HMPUR HHD 6002 Born2Bond™

HHD 6002 is a one-component, solvent-free, moisture-curing hot-melt polyurethane adhesive. Upon application, the adhesive reacts with the surrounding moisture or the water content of the substrate to form a thermoset cross-linked adhesive. Specifically designed for electronic assembly, HHD 6002 can bond various substrates such as PC, ABS, aluminum, glass, etc. Here’s a summary of its advantages:

• Moisture-curing.
• Viscosity: 5500 @130ºC.
• Ability to provide initial bonding strength upon cooling prior to processing.
• Adheres to various substrates.
• White color.
• Good flexibility.
• Excellent adhesion to a wide range of substrates including glass and metal.
• Low application temperature (110°C – 130°C).
• High thermal stability.
• Precise adhesive distribution.
• Balanced strength and elasticity.
• Good chemical resistance.
• Resistant to sweat and oils.

Application

HHD 6002 is specially designed for assembling electronic devices and can bond to various substrates (PC, ABS, aluminum, glass, etc.).

Application Method

Born2bond HMPUR solutions cover a wide range of viscosities, providing flexibility in choosing processing methods. HHD 6002 can be applied by bead, dot, spiral, and mist spraying. The typical application temperature range is 100°C – 130°C.

Usage Guidelines

• Remove the aluminum vacuum bag immediately before use.
• Preheat the cartridge at the recommended temperature if necessary.
• Remove the end cap and outer layer on the adhesive surface.
• Connect the cartridge conversion kit.
• Remove any caps and blocks at the head.
• Select the appropriate needle and attach it to the nozzle of standard air distribution components.
• Place the cartridge in the heating part, ensuring that the adhesive is heated to the recommended application temperature.
• Clean a small amount of adhesive.
• Apply a sufficient amount of adhesive to one of the clean, uncontaminated surfaces (oil, dust, mold inhibitors, etc.).
• Bond the substrates within the open time of the adhesive.
• Press and hold the joints firmly to allow the adhesive to achieve sufficient strength.

Storage Instructions

HHD 6002 can be stored for 6 months in unopened packaging in a dry place at temperatures ranging from +15°C to +25°C. It must be used promptly after opening the container. Seal the containers tightly to minimize contamination.

Product Properties

“*Based on Brookfield viscosity.
**Open time is an application-dependent parameter depending on environmental temperature, substrate, and application process.

Cure Performance

The curing speed depends on the substrate type, moisture, and surrounding environmental conditions. HHD 6006 will develop bonding properties within 24 hours. However, optimal properties are achieved after three to seven days at room temperature.

For all performance data provided in this TDS, samples were prepared as follows: A 1.5 mm * 2 mm adhesive bead was applied from one PC to another using a 0.12 mm spacer. A 1 kg weight was placed on the sample for 20 seconds, then the sample was conditioned for 3 days at 23°C/50%RH before testing. Tests were conducted at a speed of 2 mm/minute.

Curing Speed

Sample preparation and testing conditions: A 1.5 mm * 2 mm adhesive bead was applied from one PC to another using a 0.12 mm spacer. A 1 kg weight was applied to the sample for 20 seconds, then the sample was conditioned for 7 days at 23°C/50%RH. Testing speed @ 2 mm/minute.

Application process – viscosity

Testing method: Brookfield, spindle 27 @ 20rpm, 27°C @ 60% RH, 11.6g sample, run for 30 minutes at each temperature without load.

Adhesive performance with substrates

Thermal bonding strength

Sample preparation and testing conditions: A bead of adhesive with dimensions of 1.5 mm*2 mm is bonded from one PC to another using a 0.12 mm spacer. A 1 kg weight is applied to the sample for 20 seconds, after which the sample is conditioned for 7 days at 23°C/50%RH. The testing speed is conducted @ 2 mm/min after exposure to heat for 5 minutes in a chamber.

Sweat & sebum resistance

Sample preparation and testing conditions: A bead of adhesive with dimensions of 1.5 mm*2 mm is bonded from one PC to another using a 0.12 mm spacer. A 1 kg weight is applied to the sample for 20 seconds, after which the sample is conditioned for 3 days at 23°C/50%RH before being immersed in sebum and sweat at 45°C for 7 days. The testing speed is conducted @ 2 mm/min.

• Bonding strength before exposure: 6.4.
• Bonding strength after sweat exposure: 6.2.
• Bonding strength after sebum exposure: 3.5.

Born2Bond^™ HMPUR HDD Series

Born2Bond™ HMPUR HHD (Hot Melt Polyurethane Reactive) adhesives, such as HHD 6002/6006/6009, from Bostik, are versatile one-component solutions capable of bonding various substrate types. With different viscosities and open times, they allow precise application across different assembly applications and processes.

Guide to selecting HMPUR HHD 6002/6006/6009 adhesives:

With excellent bonding performance (both hardness and elasticity), high-performance HMPUR adhesives withstand temperature and humidity fluctuations. They also resist impact, thermal shock, and various chemical and organic compounds, including sweat and oils—making them ideal for use in handheld devices and wearable electronics.

 

Advantages of the Born2Bond™ HMPUR HDD series:

• Moisture-curing.
• Adheres to various substrates.
• Suitable for multiple application methods.
• Balances strength and elasticity well.
• Adheres to multiple substrates.
• Low application temperature.
• Good resistance to temperature, humidity, and chemicals.
• Single-component solution.

Identifying corresponding application methods:

Born2Bond HMPUR solutions span various viscosity levels, offering flexibility in application method selection:

• Low-viscosity products can be dispensed in bead form.
• High-viscosity products allow for pellet application.
• Some products can be applied using all three methods.

Identifying process requirements:

While the suggested application temperature for Bostik’s HMPUR solutions is generally similar (typically between 110°C – 130°C), other process parameters can also guide product selection. These include:

• High-throughput production lines may require products with high initial strength.
• Other processes may require extended processing windows to position components before adhesive bonding.
• Bostik’s HMPUR solutions encompass various considerations during the processing stage.

Meeting performance requirements:

Substrate adhesion is a primary concern. Some Bostik HMPUR products excel more than others in adhering to low-energy substrates. For example:

• Polyurethane adhesives, once cured, typically exhibit good resistance to chemicals, solvents, and water. Bostik’s HMPUR product line offers varying degrees of resistance to these conditions.
• Polyurethane adhesives can create rigid bonds or bonds with more elastic properties.