HMPUR HHD 6006 Born2Bond™

HHD 6006 is a one-component, solvent-free, moisture-curing hot melt polyurethane adhesive. Upon application, the adhesive reacts with the moisture in the surrounding environment or the water content of the substrate to form a thermoset cross-linked adhesive.

• Moisture-curing.
• Viscosity: 6000 @130ºC.
• Low application temperature (120°C – 140°C).
• Accurate adhesive distribution.
• Good flexibility.
• Excellent adhesion to various substrates including glass and metal.
• High thermal stability.
• Balanced strength and elasticity.
• Good resistance to chemicals.
• Resistant to sweat and grease.

Application

HHD 6006 is specially designed for electronic assembly and can bond various substrates (PC, ABS, aluminum, glass, etc.).

Application Method

Born2bond HMPUR solutions span across various viscosity types, offering flexibility in processing methods. HHD 6006 can be applied by spraying, bead laying, screw extrusion, and misting. The typical application temperature range is 100-130°C.

Usage Instructions

• Remove the aluminum vacuum bag just before use.
• Preheat the dispensing nozzle at the recommended temperature if necessary.
• Remove the end cap and outer layer on the adhesive surface.
• Connect the nozzle converter.
• Remove the cap and any blocks at the nozzle end.
• Select the appropriate needle and attach it to the nozzle head of regular air distributors.
• Place the nozzle into the heated part, ensuring that the adhesive is heated to the recommended application temperature.
• Clean a small amount of adhesive.
• Apply a sufficient amount of adhesive to a clean surface (free of oil, dust, mold inhibitors, etc.).
• Bond the substrates within the open time of the adhesive.
• Press and hold the joints firmly to allow the adhesive to achieve sufficient strength.

Storage

HHD 6006 can be stored for 6 months in its original, unopened packaging in a dry place at temperatures ranging from +15°C to +25°C. It must be processed immediately after opening the container. Seal the containers tightly to minimize contamination.

Product Characteristics

*Based on Brookfield viscosity measurement.
**Open time is an application parameter dependent on environmental temperature, substrate, and application process.

TYPICAL PERFORMANCE OF CURED MATERIAL

The processing speed depends on the type of substrate, moisture, and surrounding environmental conditions. HHD 6006 will develop adhesive properties within 24 hours. However, optimal properties are achieved after three to seven days at room temperature.

For all performance data provided in this TDS, samples are prepared as follows: A bead of adhesive with dimensions of 1.5 mm*2 mm is applied from one PC to another using a 0.12 mm spacer. A weight of 1 kg is placed on the sample for 20 seconds, then the sample is processed for 3 days at 23°C/50%RH before testing. Tests are conducted at a speed of 2 mm/min.

Cure Rate

Preparation and testing conditions for samples: A bead of adhesive with dimensions of 1.5 mm*2 mm is applied from one PC to another using a 0.12 mm spacer. A weight of 1 kg is placed on the sample for 20 seconds, then the sample is processed for 7 days at 23°C/50%RH. The testing speed is set at 2 mm/min.

Application Procedure – Viscosity

Testing Method: Brookfield, spindle 27 @ 20rpm, 27°C @ 60% RH, 11.6g sample, run unloaded for 30 minutes at each temperature.

Bonding Performance with Substrates

• Before: 10,3.
• After sebum: 8,3.
• After sweet: 6,3.

Born2Bond^™ HMPUR HDD Series

Born2Bond™ HMPUR HHD (Hot Melt Polyurethane Reactive) adhesives, such as HHD 6002/6006/6009, from Bostik, are versatile one-component solutions capable of bonding various substrate types. With different viscosities and open times, they allow precise application across different assembly applications and processes.

Guide to selecting HMPUR HHD 6002/6006/6009 adhesives:

With excellent bonding performance (both hardness and elasticity), high-performance HMPUR adhesives withstand temperature and humidity fluctuations. They also resist impact, thermal shock, and various chemical and organic compounds, including sweat and oils—making them ideal for use in handheld devices and wearable electronics.

Advantages of the Born2Bond™ HMPUR HDD series:

• Moisture-curing.
• Adheres to various substrates.
• Suitable for multiple application methods.
• Balances strength and elasticity well.
• Adheres to multiple substrates.
• Low application temperature.
• Good resistance to temperature, humidity, and chemicals.
• Single-component solution.

Identifying corresponding application methods:

Born2Bond HMPUR solutions span various viscosity levels, offering flexibility in application method selection:

• Low-viscosity products can be dispensed in bead form.
• High-viscosity products allow for pellet application.
• Some products can be applied using all three methods.

Identifying process requirements:

While the suggested application temperature for Bostik’s HMPUR solutions is generally similar (typically between 110°C – 130°C), other process parameters can also guide product selection. These include:

• High-throughput production lines may require products with high initial strength.
• Other processes may require extended processing windows to position components before adhesive bonding.
• Bostik’s HMPUR solutions encompass various considerations during the processing stage.

Meeting performance requirements:

Substrate adhesion is a primary concern. Some Bostik HMPUR products excel more than others in adhering to low-energy substrates. For example:

• Polyurethane adhesives, once cured, typically exhibit good resistance to chemicals, solvents, and water. Bostik’s HMPUR product line offers varying degrees of resistance to these conditions.
• Polyurethane adhesives can create rigid bonds or bonds with more elastic properties.